(Thanks to neo2046 for bringing this information to our attention.)
Originally Posted by neo2046
Nintendo 3DS uses DMP's PICA(R)200 chip
PR (no English version yet)
PICA200 is an OpenGL ES1.1 chip featuring a set of proprietary extensions that enable a variety of features that one might normally implement via ES2.0 shaders through a fixed hardware pipeline.
The PICA200 scales with up to four pipelines and processes from up to four programmable vertex units. The 3D core, using their proprietary graphics technology named MAESTRO-2G, the second generation of the Maestro design, implements custom graphics algorithms as hardware for enabling a set of shading features that include per-vertex sub-surface scattering, bidirectional reflectance distribution function, cook-torrance, polygon subdivision, and soft shadowing. Their image post-processing module, the PICA-FBM frame buffer management, can polish the image with anti-aliasing and a set of other 2D functions and can actually be licensed independently as a core for 2D-only devices. In either case, the PICA-FBM can be extended with a PICA-VG vector graphics module.