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PS5 Devkit Patent finally fully disclosed

Let me start with the link.
Vapor chamber confirmed.

Abstract
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An electronic device (10) has a plurality of cooling fans (15) for supplying air to a heat sink (30). The plurality of cooling fans (15) create air flows (Fh) that pass through the heat sink (30) from a first side (H1) of the heat sink (30) toward a second side (H2) of the heat sink (30). The heat sink (30) is disposed oblique to the left-right direction and the front-rear direction of the electronic device (10). An exterior member (40) has an intake port (41i) formed along the first side (H1) of the heat sink (30) and oblique to the front-rear direction and the left-right direction.


Most interesting image is this
833qxgp1eNB4N3pA7Az19KfXLKhI8wd0AiASjcII54ggvWpFpQcHvua3ksVO9msdRE4D7PVG6gJaPDiDWZNt9DB2nLsIvsYhWbZJyAyEnUEohHy8G3oPNDtsUTBkUZgP26kkeifN6FV0Tn5k2W2Pwg


As shown in FIG. 6, the electronic device 10 has a heat sink 30. The heat sink 30 is connected to the integrated circuit 11a (see FIG. 6) which is a heat source mounted on the circuit board 11 and receives heat from the integrated circuit 11a. The electronic device 10 has a plurality of cooling fans 15 (see FIG. 6 ), and the heat sink 30 is cooled by receiving the air flow formed by the cooling fans 15. The heat sink 30 is one of the cooling target components described in the claims.

 In the example shown by the electronic device 10, the heat sink 30 is arranged above the circuit board 11. As shown in FIG. 6, the heat sink 30 has a plate-shaped bottom portion 31 and a plurality of fins 32 formed on the bottom portion 31. The bottom 31 is in contact with the integrated circuit 11a. The heat of the integrated circuit 11a is transferred from the bottom portion 31 to the fin 32. The shield 12 may have an opening for exposing the integrated circuit 11a so as to allow contact between the integrated circuit 11a and the heat sink 30.

The bottom 31 is, for example, a vapor chamber. That is, the bottom portion 31 is, for example, a metal plate having a space in which a liquid that easily vaporizes is enclosed. The bottom portion 31 may be a metal plate (metal block) having no such space. The fins 32 are welded to the bottom portion 31 and are arranged in the direction along the circuit board 11.

So from what I gather downside of the motherboard is also connected to the heatsink. Interesting images in there.
 
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You tell me. You posted the thread.
So you don't get sarcasm too huh. There wasn't a new thread and my question was rhetorical you genius (see sarcasm), it was to say there is no separate thread on it and created one because it is thread worthy!

Anyway are you going to continue to post nonsense or are you going to post something on the subject? (See: get on point and stop trolling)
 
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I seriously hope it doesn't look like that. It's basically a fucking toilet seat.
I think general shape will be the same, as in a mirrored V shape. BUT the design will be much sleeker. And also the cooling improved even more because 6 fans might be too much, 1 on each side is more probable.
 
So you don't get sarcasm too huh. There wasn't a new thread and my question was rhetorical you genius (see sarcasm), it was to say there is no separate thread on it and created one because it is thread worthy!

Anyway are you going to continue to post nonsense or are you going to post something on the subject? (See: get on point and stop trolling)

About five hours ago. (see: you are wrong and I'm right, yay, I love that feeling!)

My comment wasn't rhetorical and, seeing who you couldn't find the thread, apparently neither of us our geniuses (see: reading comprehension).
 

nosseman

Member
What is the meaning of these patents really?

Yeah - we have a heatsink and some fans that sucks air from one side and blow air in the other side. No one ever thought of that before!!!

(since this does not mention the double-sided heatsink/heatpipe that is new)
 

Jtibh

Banned
All i see is a lot of noise.

Also do i have to worry about humidity if enclosed in a cabinet?
 

GHG

Gold Member
Waiting patiently for PS thicc.

It's a shame @Elektro_Demon isn't still around to witness history. He would have blown his load.
 

LordOfChaos

Member
I can dig it. There's nothing but heatsink and fans in one side of the V, which probably means they can maintain a high static pressure at relatively low speeds, and with the way the PS5 APU works, constant power rather than cycling up and down like the current consoles.
 

DESTROYA

Member
I dont know. If its a vapor chamber but in an eclosed enviroment will it create any condensation ?

Vapor Chambers are filled with coolant that, when heated, change phases from a liquid to a gas and back again. The vaporized coolant circulates via convection and moves freely through the chamber. The molecules then condense on cold surfaces, dissipate their heat load, and are channeled back to the coolant reservoir.

It’s all internalized so theres no condensation on the outside just in the vapor chamber itself.
 

Jtibh

Banned
Vapor Chambers are filled with coolant that, when heated, change phases from a liquid to a gas and back again. The vaporized coolant circulates via convection and moves freely through the chamber. The molecules then condense on cold surfaces, dissipate their heat load, and are channeled back to the coolant reservoir.

It’s all internalized so theres no condensation on the outside just in the vapor chamber itself.
Ok perfect.
This is important to me as i unlike other dont want to see the unit and its stoved away in a cabinet.

I just hope the noise level is reduced vs using traditional fan cooling.

I never had vapor chamber cooling in my life so this is all new to me
 

Jon Neu

Banned
Relax with the fanboy nonsense just pointing out your hot take thinking this is it’s final form.
It’s like criticizing a caterpillar for being ugly before we know how it looks when it’s fully mature.

You should take your own advice and relax a little before jumping to conclusions. I’ve said nothing about “final forms”.

I mean, if you read the title of the thread it says “devkit” in it.
 
No i thought you said you liked it :messenger_tears_of_joy:
I even clarified in my previous post and you still posted that ugly pic, so I thought you liked it. :messenger_tears_of_joy:

But even that huge abomination is not as disgusting as ps5 devkit. Atleast you would have space for multiple APU and the space for some beefycooling allowing for twice the performance pf ps5.
 
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nani17

are in a big trouble
I even clarified in my previous post and you still posted that ugly pic, so I thought you liked it. :messenger_tears_of_joy:

But even that huge abomination is not as disgusting as ps5 devkit. Atleast you would have space for multiple APU and the space for some beefycooling allowing for twice the performance pf ps5.


oh it's been a long day sorry :messenger_tears_of_joy: :messenger_tears_of_joy:
 

DESTROYA

Member
You should take your own advice and relax a little before jumping to conclusions. I’ve said nothing about “final forms”.

I mean, if you read the title of the thread it says “devkit” in it.
Why would you care if a Dev Kit is ugly, it’s only a prototype?
OP was talking about the internals not what it looks like. So yeah relax.
 

Yoda

Member
I suspect we'll see the "V" incoporated somehow. I realllllllllllllllllllllllllllllllllllllllllllllllllllllyy hope it isn't that thick.
 
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