TSMC has already produced a total of 500,000 chips at 5nm, and its defect density is improving faster than the 7nm generation. Fab 18, in southern Taiwan, has been mainly responsible for TSMC’s 5nm process. The company announces that Fab 18 will expand further, and by 2023 TSMC’s 5nm capacity will quadruple compared to its capacity in 2020. The company already aimed to increase its 5nm capacity to 150,000 wafer per month by the end of this year.AMD will soon move all production to 5nm. We might see PS5 pro or PS5 SLIM on 5nm from 2023. Apple is moving to 4nm, 3nm soon out of 5nm.
Also under the spotlight is Fab 21, the 5nm plant in Arizona. TSMC confirms that construction has been underway, with volume production scheduled in 2024.
Since its announcement at the Technology Symposium last year, the development of 4nm has been smooth, according to TSMC. Risk production will start earlier than expected in Q3 this year, instead of the previously announced Q4. The upcoming 4nm capacity has already been fully booked by Apple. TSMC estimated that 4nm would be the main process node for mainstream, mid to low-end products after 2023.
3nm and beyond: leading the worldExpected to enter volume production in the second half of 2022, the 3nm node is expected to be the world’s most advanced manufacturing node. It will be the last process node using the FinFet transistor architecture, and it will offer a 70% logic density gain and 15% speed gain compared to 5nm, with 30% less power consumption.