Might be interesting for those charting the possibilities of a smaller/slimmer version of PS3 down the road. Or just costs. I didn't think heatsinks got so much attention, but there ya go
http://techon.nikkeibp.co.jp/english/NEWS_EN/20080424/150927/
Wow, 700g for the heatsink alone in the first generation :lol
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http://techon.nikkeibp.co.jp/english/NEWS_EN/20080424/150927/
Furukawa Electric Co Ltd exhibited a new heat sink for the PlayStation 3 (PS3), a game console developed by Sony Computer Entertainment Inc (SCE), at Techno-Frontier 2008. The exhibition took place from April 16 to 18, 2008, at Makuhari Messe in Chiba Prefecture, Japan.
And it already begun commercial production of the third-generation heat sink for the PS3. The third-generation product is characterized by its small size, light weight and low cost.
Especially, the shift from the second generation to the third was drastic. In the first and second-generation products, a large heat sink cooled both the Cell and RSX. But they are cooled by separate heat sinks in the third-generation product.
Furthermore, copper heat pipes, which were used in the first- and second-generation heat sinks, are no longer used in the third-generation product.
The first-, second- and third-generation products support power consumptions of about 200, 160 and 130-140W, respectively, for both the Cell and RSX.
The kinds of components are more than 20 for the first generation and about 10 for the second. But the third-generation product has only three kinds of components
As a result, the weights of the first-, second- and third-generation products are about 700, 500 and 350g, respectively.
Wow, 700g for the heatsink alone in the first generation :lol
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