Came across these Press Releases:
MoSys
In addition from Gamasutra:
NEC Predicts Profits On Wii Chip Orders
MoSys
NECMoSys' 1T-SRAM(R) Embedded Memory Technology Enables Nintendo's Next Leap in Video Games; High Performance, High Density 1T-SRAM Powers Upcoming Wii Home Game Console
SUNNYVALE, Calif.--(BUSINESS WIRE)--June 19, 2006--
MoSys, Inc. (Nasdaq:MOSY), the industry's leading provider of high-density system-on-chip (SoC) embedded memory solutions, today announced that Nintendo's upcoming Wii(TM) video game console uses MoSys' patented 1T-SRAM technology to implement the very high performance memory within the Wii console's graphics system.
This is the latest result from the more than six-years-long technical collaboration between the two companies. Previous generations of MoSys' 1T-SRAM technology were incorporated in Nintendo's earlier game console, the Nintendo GameCube(TM), in 1999, and shipped in multi-million quantities. The newest 1T-SRAM implementations embedded within the Wii console are fabricated using NEC Electronics' advanced 90nm CMOS-compatible embedded DRAM process technology. These high speed and ultra low latency memories are used as the main embedded memory on the graphics chip and in an additional external memory chip.
"We are pleased that Nintendo has again chosen our 1T-SRAM to power their latest generation game console," said Chet Silvestri, chief executive officer at MoSys, Inc.
"Designing the Wii console required an incredible list of breakthroughs in technology and innovation. The performance delivered by MoSys' 1T-SRAM technology is an important element of our solution," said Genyo Takeda, Senior Managing Director, General Manager, Integrated Research & Development Division at Nintendo. "The graphic performance of Wii benefits from MoSys' ability to develop highly innovative and dependable embedded memory products."
I think it's confirmation of info already revealed. Are there any tech savvy people who could explain what this means, thanks.Nintendo's New Wii(TM) Video Game Console Uses NEC Electronics' Embedded DRAM
KAWASAKI, Japan, SANTA CLARA, Calif., June 19, 2006
NEC Electronics today announced that Nintendo Co., Ltd. has selected NEC Electronics' 90-nanometer (nm) CMOS-compatible embedded DRAM (eDRAM) technology for WiiTM, its innovative new video game console. Designed to provide advanced graphics functions for this new gaming platform, the new system LSI chips with eDRAM will be manufactured using advanced technologies on NEC Yamagata's 300-millimeter (mm) production lines.
Embedded DRAM technology integrates DRAM on the same chip with logic circuits, and is viewed as an optimal solution for three-dimensional (3D) graphics acceleration systems and other applications that need to process high bandwidth data using low power. In the past, the integration of an eDRAM structure with a standard CMOS process proved challenging. NEC Electronics achieved its fully CMOS-compatible eDRAM technology by integrating a metal-insulator-metal 2 (MIM2) stacked DRAM capacitor on the company's standard CMOS process.
NEC Electronics first introduced MIM2 technology on 90 nm eDRAM in 2005, and volume production started that same year. The technology requires a material with a high dielectric constant to be placed between two electrodes, and a large charge to be maintained on the capacitor with low leakage and a small cell size. NEC Electronics has achieved this by 1) using a MIM structure for the electrodes in the DRAM cell to achieve lower resistance values and higher data processing speeds, 2) using cobalt-silicide (CoSi) DRAM cell transistors to increase driving performance, and 3) using zirconium-oxide (ZrO2) in the capacitance layer (ahead of other vendors) to increase capacitance of the unit area. These and other breakthroughs have allowed NEC Electronics to develop eDRAM chips using its most advanced 90 nm process and to secure its roadmap to 55 nm eDRAM and beyond.
Available now with NEC Electronics' unique 90 nm CMOS-compatible eDRAM process, the ASICs deliver significant advantages that promise to continue along the technological roadmap toward 55 nm processes and beyond.
NEC Electronics selected MoSys® as the DRAM macro design partner for the Wii devices because MoSys is experienced in implementing 1T-SRAM® macros on NEC Electronics' eDRAM process. MoSys designed the circuits and layout of high-speed 1T-SRAM macros on NEC Electronics' 90 nm CMOS-compatible eDRAM technology.
The adoption of these eDRAM ASICs for Nintendo's new game console is a clear vote of confidence in NEC Electronics' eDRAM technology. The company is committed to delivering more value-added features to spur the adoption of its CMOS-compatible eDRAM solutions across a wide range of applications.
In addition from Gamasutra:
NEC Predicts Profits On Wii Chip Orders
A new report from news agency Bloomberg indicates that Japan-based electronics manufacturer (and former console hardware creator) NEC Electronics has forecast its first operating profit in more than a year, based on orders for semiconductors used in consumer electronics including the Nintendo Wii.
NEC was last profitable in the quarter ended March 2005, but now forecasts an operating profit of 5 billion yen ($44 million) for the year ending March 2007, compared with a 35.7 billion yen loss for the year previous.
NEC Electronics CEO Toshio Nakashima confirmed in late April during the company's annual earnings announcement that it entered into an agreement with Nintendo to produce large-scale integration chips (LSIs) for the upcoming Wii console. Nakashima noted in the call that NEC had begun plans to upgrade the production capacity at NEC's Yamagata factory to keep up with Nintendo's demand for the chips, with the improvements scheduled to be completed by September.
In an earlier sign of support for the Wii, NEC also confirmed in March at GDC that it had partnered, alongside partner Hudsonsoft, with Nintendo to offer TurboGrafx-16 video games for download over the upcoming Wii's Virtual console.
According to the Bloomberg report, NEC Electronics is projecting a return to profit as it focuses on semiconductors that can be used in more devices, while the company continues to focus on lowering production and development costs.