jeff_rigby
Banned
Edit: This OP post is in error. My opinion: Game console is a special case covered under NDA and this is what caused the confusion between dates for the game console in the first Oct 2011 AMKOR PDF and the Industry at large in the second AMKOR Oct 2011 PDF in a presentation at an industry lecture. Game consoles will be 6-8 months ahead of AMD's other products using the same technology. (First AMKOR PDF agrees with the Yole PDF on 2.5D wide IO memory in the PS4) Edit: 512 bit wide custom DDR3 is not the same as WideIO as WideIO has a different standard for communication. The principals are the same and even some articles are confusing this issue.
Edit on edit: First take is apparently accurate and Sony to release in 2013 is using GDDR5 to get the same bandwidth.
This explains the rumored delay for Sony unless some still don't believe Sony is supporting wide IO via transposer.
This could impact BOTH consoles as AMD/GF is using AMKOR, only if Microsoft is using AMD/TSMC would it not impact the Xbox 720.
More info: this would be something related to the transposer which should Fab first and might be Oban. Sweetvar26 said Sony was first, 6 months behind but now on track?
If this is related to the transposer => Oban is a large blank Japanese gold coin with bumps (transposer description) then Charlie was correct but didn't have the whole story. We may see another article soon.
EDIT:
http://www.i-micronews.com/upload/Rapports/3D_Silicon_&Glass_Interposers_sample_2012.pdf
Page 10 above picture stating PS4 will use 2.5D stacking
Page 16 2013 start of Game station and controllers using 2.5D stacking
page 17 continues with a forecast to 2017 of Game console % use of 2.5D stacking
2013 as the start of game console 3D stacking in this 2012 PDF contradicts the AMKOR Oct 27, 2011 and 2012 PDF. There are two versions of the OCT 2011 AMKOR PDF, one in the OP and the one found by systemfehler. Both are Oct 2011 but the second below has NEW information on increasing yield by splitting large Logic (CPU or CPU) chips into smaller packages. This second Oct PDF agrees with the 2012 PDF that 2.5D products will ship the middle of 2014.
http://sites.amd.com/la/Documents/TFE2011_001AMC.pdf
http://imapsaz.org/wp-content/uploads/2011/05/Amkor-IMAPS-presentation-Oct27-2011.pdf
Best guess is that the AMKOR OCT 27 and 2012 product intercepts do not include game consoles while the first is about game consoles. This created the confusion. I can continue with a wall of explanation but I believe it's obvious.
Either AMKOR in the same month (OCT 2011) revised their projection forward 6 months and Yole has their information from 2012 in error or the second AMKOR PDF with the revised timeline is to "IMAPS Presentation" for the industry and information about game consoles is edited out as it's a special case and falls under NDA which still applies to the 2012 AMKOR PDF.
Thanks to systemfehler for finding the second OCT 2011 AMKOR PDF.
Edit on edit: First take is apparently accurate and Sony to release in 2013 is using GDDR5 to get the same bandwidth.
http://semiaccurate.com/forums/showpost.php?p=173901&postcount=903 said:To whichever company using Amkor, could this be the confirmation of the rumors of delay for production?
PDF from Oct 2011
Page 2
Si Interposer + DDR + Logic
GPU / CPU (28nm)
http://sites.amd.com/la/Documents/TFE2011_001AMC.pdf
PDF from Feb 2012
Page 10
http://www.amkor.com/download.cfm?d...DC8BFAE253&typename=dmFile&fieldname=filename
On page 10 we see the same chart as in the Oct 2011 document, but with Si Interposer + DDR + Logic chip delayed 6 months, pushed into mid 2014
http://semiaccurate.com/forums/showpost.php?p=173907&postcount=905 said:The updated PDF from Feb 2012 fits the timeline, if we assume it's MS they're talking about for that specific chip. Chip goes into production in Jan, and yields are horribly low as Charlie reports later in Sep. Amkor of course knows already straight away hence the updated PDF in Feb.
Obviously AMD is using Amkor (look at the pic, uses the same font as in the PDFs ) but as far as the Si Interposer + DDR + Logic chip at 28nm goes, whoever that product is being produced for will get delayed. It fits in with what we hear about 720 so far, but could it also be PS4?
This explains the rumored delay for Sony unless some still don't believe Sony is supporting wide IO via transposer.
This could impact BOTH consoles as AMD/GF is using AMKOR, only if Microsoft is using AMD/TSMC would it not impact the Xbox 720.
More info: this would be something related to the transposer which should Fab first and might be Oban. Sweetvar26 said Sony was first, 6 months behind but now on track?
If this is related to the transposer => Oban is a large blank Japanese gold coin with bumps (transposer description) then Charlie was correct but didn't have the whole story. We may see another article soon.
EDIT:
http://www.i-micronews.com/upload/Rapports/3D_Silicon_&Glass_Interposers_sample_2012.pdf
Page 10 above picture stating PS4 will use 2.5D stacking
Page 16 2013 start of Game station and controllers using 2.5D stacking
page 17 continues with a forecast to 2017 of Game console % use of 2.5D stacking
2013 as the start of game console 3D stacking in this 2012 PDF contradicts the AMKOR Oct 27, 2011 and 2012 PDF. There are two versions of the OCT 2011 AMKOR PDF, one in the OP and the one found by systemfehler. Both are Oct 2011 but the second below has NEW information on increasing yield by splitting large Logic (CPU or CPU) chips into smaller packages. This second Oct PDF agrees with the 2012 PDF that 2.5D products will ship the middle of 2014.
http://sites.amd.com/la/Documents/TFE2011_001AMC.pdf
http://imapsaz.org/wp-content/uploads/2011/05/Amkor-IMAPS-presentation-Oct27-2011.pdf
Best guess is that the AMKOR OCT 27 and 2012 product intercepts do not include game consoles while the first is about game consoles. This created the confusion. I can continue with a wall of explanation but I believe it's obvious.
Either AMKOR in the same month (OCT 2011) revised their projection forward 6 months and Yole has their information from 2012 in error or the second AMKOR PDF with the revised timeline is to "IMAPS Presentation" for the industry and information about game consoles is edited out as it's a special case and falls under NDA which still applies to the 2012 AMKOR PDF.
Thanks to systemfehler for finding the second OCT 2011 AMKOR PDF.