x@3f*oo_e!
Member
Afaiik the extra CUs in Series X (56 not 60 afaik) should take up around 48mm2 based on estimates from the information currently available (56 CU @ 47% of die size .. so just using simple maths) That's probably an overestimate because CUs are not all of the GPU partSure, but 43mm2 bigger with 30 more CU’s (PS5 is “estimated” at around 308 mm2 for a 40 CU’s design and XSX has 60 CU’s, each has disabled CU’s, and we do not know the size of the CU’s in PS5 and in XSX, but we can see how big the GPU portion of the die is). We also know they have a wide memory interface and I suspect those GDDR6 memory controllers to take more space to/make for a bigger die. I think the due size difference is covered well by the extra CU’s and the wider memory bus solution with space to spare (look how comparatively smaller the beastly Ryzen 2 CPU cores, cache aside, are).
There is also one extra GDDR5 controller on die (~5mm2?) so if everything else is equal this means there is ~10mm2 (or even more) extra die space (compared to Series X) on PS5 chip for functions that isn't CPU/GPU/DRAM controller. I believe the SSD controller is separate, and haven't yet seen a PS5 die shot so I really don't know exactly what that is.
Maybe you can get a better guess
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