How is a 2.5D stack structured? That doesn't make any sense to me...
2.5D, 3D and 3D wafer stacking all provide nearly the same benefits in reduced wire lengths.
1)
2.5D is a standard chip with the silicon vertically connected to another chip using an interposer composed of TSVs. Generally only
one layer or package on top of the interposer. More than 10 year old technology seen in Handhelds and expensive.
2)
3D is same type silicon I.E. Memory or FPGA or GPU that can be stacked atop each other in
multiple layers using TSVs. Also silicon chip connected to another chip with pre-manufactured into the two silicon blocks bumps and traces so it doesn't need an interposer. 3-4 years old less expensive in volume than 2.5D.
3)
3D wafer stacking is silicon wafers designed to standards so they mate properly and have TSVs through them to
allow multiple different types of chips to be stacked atop each other in multiple layers. 3D wafer stacking is the last phase and with volume has several aspects that allow chips to be less expensive. It's coming on-line in 2013
Memory for instance can be manufactured as 3D stacks and connected to a CPU using an interposer. That would be considered 2.5D. You can have a combination of 2.5D and 3D stacking.
AMD’s future belongs to partitioning of functions among chips that are process-optimized for the function (CPU, Cache, DRAM, GPU, analog, SSD) and then assembled as 3D or 2.5D stacks.
AMD is part of AMD-IBM-Samsung and designing silicon wafers to STANDARDS so that they can be 3D wafer stacked. This is the most economical method with game console volumes.
Very interesting info btw. I could be seeing this entirely wrong, but from what I'm reading it seems like fabric computing is a pretty big deal and beyond the scope of gaming.
On the PS3 with multiple CPUs of different types in the Cell, Game developers had to manage memory and insure the CPUs didn't step on each other requesting memory access, the application developer had to do tasks that should have been transparent and part of the OS. With a Fabric computing memory model the OS handles more of what it should be doing and CPUs can talk to each other and pass pointers to memory to hand off finished data for a job they were better at doing to another different type of CPU to do what it is better at doing.
Fabric computing memory model can have efficiencies as well as make the programmers job easier. Yes it should be part of any new computer, game console or consumer electronics networked ecosystem. This is going to have a HUGE impact in the next 10 years! If it were in the PS3 there would have been much happier game developers and fewer complaints about the Cell. Processes have evolved to catch up with the Sony-Toshiba-IBM's vision of Cell's heterogeneous computing and distributed computing model (HSA & Fabric Memory Model).
Cell and Cell like current GPUs (multiple simple CPU elements inside a package) would need a redesign to take advantage of Fabric computing but individual CPUs just need enough cache and access to fast memory as well as OS routines that support Fabric computing.
http://mandetech.com/2012/01/10/sony-masaaki-tsuruta-interview/ Sony CTO interview on Playstation tech
http://semiaccurate.com/2012/03/02/sony-playstation-4-will-be-an-x86-cpu-with-an-amd-gpu/ Article on PS4 leaks parallels Sony CTO interview but adds AMD Fusion
http://www.gsaglobal.org/events/2012/0416/docs/3D_Panel.pdf Game Console SOCs shown using 3D stacked DDR3 (faster, cheaper & more energy efficient than XDR2) and 3D ultra wide I/O memory (30 times (1Tbit/sec) faster than XDR2 )
AMD supplied PDF showing features in APU chipset with MANY future game console related must have features
http://eda360insider.wordpress.com/2011/12/14/3d-week-driven-by-economics-its-now-one-minute-to-3d/ AMD planning 5 years for 3D stacking but not mentioning it.
http://www.eetimes.com/electronics-news/4235499/AMD-s-Macri-talks-Heterogeneous-systems-architecture Video on Fusion by AMD
http://www.neogaf.com/forum/showpost.php?p=37491994&postcount=1430 AMD 2014 fusion GPUs and adding 3rd party CPUs to AMD SOC
http://www.neogaf.com/forum/showpost.php?p=37459458&postcount=1398 Power wall and the reasons for Heterogeneous computing
http://architects.dzone.com/articles/heterogeneous-computing Heterogeneous computing again
Then my conclusion. Cell vision is like HSA + Fabric computing & very attractive to Sony.
Everything in the Sony CTO interview about future Playstation tech has been touched on in the above cites.
Charlie at SimiAccurate has all but confirmed . Only question in my mind, is the 2014 design (Full HSA and Fabric computing), including GPU changes. going to be ready by PS4 launch?
Going beyond game consoles with Jaguar Fusion and Fabric computing.