dgrdsv
Member
I'm quite sure that it's on 28nm. ESRAM area shouldn't generate much heat and since the GPU part is 33% less than in PS4 both APUs should be rather comparable in their heat dissipation.
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Playstation 4 vs Xbox One Heat Dissipation
- Thread starter theusedversion
- Start date
Jokes and Riddles
Neo Member
Haha hilarious.
We are talking passive cooling here (and by passive I mean without heatsinks). I'll let you in on a secret, heatsinks on DIMMs in the PC space are mostly for branding reasons.
dgrdsv
Member
It's actually the opposite of this but even with that we're talking about very low power figures compared to the chip itself. As in not worth mentioning and comparing.
Sony has taken design ques from Silverstone. For those of you who build their own PCs you might have heard of a case they came out with called FT03:
Basically the chassis is completely closed except the intake and the outtake and that allows for the air to be funneled over all the components and pushed out the top of the case in a nice and efficient way.
I believe the PS4 is working with a similar design. I think the PS4 will use those openings along the side of the console and top of the console to pull air in and push it out of the back.
Basically the chassis is completely closed except the intake and the outtake and that allows for the air to be funneled over all the components and pushed out the top of the case in a nice and efficient way.
I believe the PS4 is working with a similar design. I think the PS4 will use those openings along the side of the console and top of the console to pull air in and push it out of the back.
Bam Bam Baklava
Member
I think people are stressing too much. The original PS3 and 360 had 90nm CPU/GPUs while PS4 and perhaps Xbone have 28nm. That alone is huge.
Lagspike_exe
Member
Uh, what does that have to do with anything? It's all about TDP, not the manufacturing process.
Bam Bam Baklava
Member
I was under the impression that smaller chips run cooler.
Lagspike_exe
Member
They do, but using a better manufacturing process means you can pack more transistors on the same area, which means they can end up emitting the same amount of heat.
sixteen-bit
Member
If "Sony is a hardware company" is the only reason, what was their excuse for the PS3 design? It was massive.
Ol No Bones
Banned
Ms had terrible hardware failures last gen. I'm sure cooling was a huge part of the design. I'm sure both will work just fine. The ps4 is probably slightly louder.
Bam Bam Baklava
Member
Early BD drive was huge, they packed in PS2 components to make it BC, and their cooling method was a giant round fan.
Both are on 28nm. Like everything else about the XBONE, some MS people didn't know what they were talking about and said it was 40nm. Wired then reported that. Then they backtracked and said 28nm as did AMD. The CPU and GPU parts of the APU were designed for 28nm, you don't just scale up. The XBONE APU on 40nm would be huge, even more so than the approx 400mm^2 that the XOBNE is already using.
OP, the size of the vent doesn't matter so much as what is going on inside the box to cool things down. I have a very souped up MSI notebook with a tiny vent on the left side and it does just fine.
Why do people bring this up? Different time. Different technology and methodology. Also different design aesthetics. The first PS3 was huge but it was a damn sweet design.
Why do people bring this up? Different time. Different technology and methodology. Also different design aesthetics. The first PS3 was huge but it was a damn sweet design.
Died from bad engineering. The temps were within spec.
It appears that Sony and Microsoft chose different cooling methods. If you browse graphics cards on Newegg or another parts store, you will see there are two common methods to cool the cards.
1) Large fan running slowly over a large heatsink. The heat from the card is pushed to the rest of the case and disipates naturally. This appears to be Microsoft's method.
2) One fan sucks in cool air and then pushes it through a channel of heatsinks out the back of the system. This appears to be Sony's method.
Sony's blower method allows for the smaller case, but blowers are often louder to get the same temperature as Microsoft's method. We will not know if this is the case until the consoles are released.
1) Large fan running slowly over a large heatsink. The heat from the card is pushed to the rest of the case and disipates naturally. This appears to be Microsoft's method.
2) One fan sucks in cool air and then pushes it through a channel of heatsinks out the back of the system. This appears to be Sony's method.
Sony's blower method allows for the smaller case, but blowers are often louder to get the same temperature as Microsoft's method. We will not know if this is the case until the consoles are released.
weekend_warrior
Banned
Or they have all those vents so they can hid cameras inside to watch you.
Have you seen the back of the PS4?
Dat Double deck diffuser
Really impressed by the design
BD was a new technology, which resulted in a rather large disc drive. More importantly, the GPU/CPU combo was much higher end relatively and emitted far more heat than the PS4 SoC will.
Trogdor1123
Member
More important than heat is the noise, are they loud?
They are going to want it to a media machine besides a gaming machine. I would not worry about it sounding like a jet this time around. They are having to cool a lot less heat this time around thanks to the Jaguar CPU. Also since it is 1 chip the cooling is much simpler than cooling 2 chips. I am not worried at all about cooling on the PS4 at all.
Callibretto
Member
does dust gathering affect console being loud? I seem to remember my launch PS3 being silent then get louder overtime, I use some air compressor and blow it around the vent to get rid of dust etc and it go back to being silent.
uncledonnie
Banned
Heh, didn't he say he hadn't even seen the hardware prior to E3?
No no, they dumped that for developer ease this time around.
He must've known more or less how the box needed to be designed: that is the rough size and how many vents. Basically everything that isn't aesthetic IE that slope.
heat rises... wait, shit
Of course. The more dust accumulates in a cooling system, the less efficient it will be. When it is less efficient, it will require higher fan speeds to maintain the same temperature.
Yes, he chose to see it at the conference.
Apparently even in the rehearsals House was holding a telephone book and mumbling the price so that it didn't leak out.
synce
Member
Have you seen the back of the PS4?
This always puts me in the mood for waffles
I H8 Memes
Member
I wouldnt worry about either one really. The size of the Xbox 1 together with that monster fan should be enough to keep it cool. And there is no way MS wants a repeat of the Red Ring failures. That would be a PR disaster that they wouldnt recover from.
The PS4 is so small that Sony could easily have made it larger if they felt they were going to have heat problems. The small size is reassuring all on its own. Plenty of ventilation on the back of the box as well in the picture above my post.
The PS4 is so small that Sony could easily have made it larger if they felt they were going to have heat problems. The small size is reassuring all on its own. Plenty of ventilation on the back of the box as well in the picture above my post.
I predict that Microsoft are using the piddliest heatsink they could get away with in order to maximise profits.
I would have thought though that vents in the top of Xbone is bad design considering they're aiming at home multimedia where devices are normally inside tight letterbox style shelves, ideally you'd want to intake from the front and out the back?
I would have thought though that vents in the top of Xbone is bad design considering they're aiming at home multimedia where devices are normally inside tight letterbox style shelves, ideally you'd want to intake from the front and out the back?
Shai-Tan
Banned
We already have pictures of the X1 internals. It looks decent sized although it's very pc in its design (regular hs+fan). It's possible the ps4 has a huge custom heatsink like what was in the ps3 and a custom designed fan.
Regarding the air flow once it's out of the system it's not that big if a concern unless the temperature in the ambient air rises and makes the air in the intake higher
Patrickv27
Member
Everyone knows the biggest problem of current gen which is heat fucking up everything. So I'm sure that was one of the priority by Sony with the PS4.
Mr_Antimatter
Member
What do the sides of the ps4 look like, anyhow? any more venting on them?
There are vents in the channel between the top and bottom half. I envisage a video one day of a teeny tiny space craft performing a bombing run down said channel.
Apart from that, the sides are smooth.
OldAsUrSock
Banned
Sony, hardware company and Microsoft is a software company. This is what happens when a software company goes against a hardware company.
What's the expected TDP for both consoles (I'm estimating about 175-185W for PS4)?
I still have a hard time acknowledging the fact that MS couldn't fit the power supply unit in that big box.
Finally, can someone help me understand:
I still have a hard time acknowledging the fact that MS couldn't fit the power supply unit in that big box.
Finally, can someone help me understand:
- What are clock frequencies of GDDR5 and ESRAM (I assume the effective speed of the DDR3 to be 2133MHz)?
- What are estimated the power draws of GDDR5 and DDR3 and ESRAM?