prinz_valium
Member
Both are diffused in Taiwan and made in Malaysia
Both are the same packaging.
Just a little different size
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PS5 and Xbox Series X SOC are made in the same fabric
- Thread starter prinz_valium
- Start date
Both are diffused in Taiwan and made in Malaysia
Both are the same packaging.
Just a little different size
A Most Virtuous Cat
Banned
They look different to me
Ps5ProFoSho
Member
Ummmmm. The architecture of the 2 chips are completely different.
By which you mean very slightly different. I mean with them both just using slightly modified versions of rdna2/ryzen3 laptop apu.
Diddy X
Member
Nintendo is the plane.
LordOfChaos
Member
They're both fabricated at TSMC ("Diffused in Taiwan") and final packaging is in Malaysia.
Very common, very old stamp combo. Not sure if this is speculating anything beyond it being TSMC, but that's it.
Very common, very old stamp combo. Not sure if this is speculating anything beyond it being TSMC, but that's it.
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geordiemp
Member
Both are diffused in Taiwan and made in Malaysia
Both are the same packaging.
Just a little different size
Just becasue they are made in the same fab and back end packaged does not mean they are the same.
Notice that some PC parts are 2.5 GHz and some are 1,9 Ghz in the leaks, this is likely slight variatons on process steps (DUV vs EUV). It will LIKELY be more expensive to use the EUV around the FinFET gates to achieve this..
Ps5 is cooled both sides with vias and liquid metal, XSX is more traditionally cooled.
If you looked closely at Ps5 teardown you can see the vias on the back and there was a heat pipe in the first cover plate, so dual side cooling effect.
I woudd say dual sided cooling with vias, TIM liquid metal heat transfer and 2.23 Ghz is quite new and unique for now, almost revolutionary IMO.
But I guess SOME of the AMD PC parts will do this as well for performance is likely if they are doing 2.5 GHz.
Could not be more different if they tried.
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thicc_girls_are_teh_best
Member
Yep. Also: 7nm DUV Enhanced 
prinz_valium
Member
I didn't imply the inner workings are the same, just the manufacturing and packaging process.
But you're wrong on being cooled from both sides.
It's liquid cooling from the top of the die. Nothing more.
Maybe it's a sandwich on the top of the die. The patent would hint to that.
Need a real teardown without cuts for that
Entroyp
Member
You need a better pic to estimate the size like that one.
USB socket: ~39px
APU: 71px x 41px (bit overestimated)
PS5 APU estimated size: 22.5mm x 13.5mm
~304mm2
It is way smaller than Series X APU.
PS. I did overestimated a bit to put a margin of error so it could be closer to 300mm2.
Nice work. The I/O complex must be in the APU, right? For a second I thought it was outside but that’s the custom flash controller.
S0ULZB0URNE
Member
But isn't as long
Md Ray
Member
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ethomaz
Banned
I believe yes the I/O complex (cache scrubbers, descompressors, co-processors, etc) is inside the APU.
The custom SSD controller not.
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El Pistolero
Banned
A comment worthy of an engineer...
MiguelItUp
Member
Consoles are consoles are consoles. Fanboys always want one to be vastly better than the other. On paper they very well may be, but in the realm of performance that never really happens, at least the past few generations. The slightest of differences, and overflowing with similarities. It's why exclusives matter most, and that will never change for consoles.
DeepEnigma
Gold Member
Different size?
That must be where the "RDNA 1.5 vs 2" comes into play.
That must be where the "RDNA 1.5 vs 2" comes into play.
Kerotan
Member
So the cost of production will reduce by even more because they both share?
DeepEnigma
Gold Member
Xbox is short & stubby PS5 chip is almost reaching the walls on both ends
They both look like side views of the consoles they are in.
ethomaz
Banned
Share? Each TSMC production has a cost because each Chip is produced different from each others... if the machine are set to produce PS5 APUs they can't produce Xbox APU.
30yearsofhurt
Member
It's almost as if they're using the same brand of APU...
The fact that PS5 SoC is about the same size as the PS4 Pro while both of them have 36CUs says a lot about how much the SoC has changed.
BluRayHiDef
Banned
The PS5's APU has components for the system's I/O system and it houses the Geometry Engine.
IntentionalPun
Ask me about my wife's perfect butthole
Different CU counts probably responsible for this difference?
00_Zer0
Member
Yeah, but I heard the twins won't go all the way, but Nintendo goes all the way to the greek islands.
iconmaster
Banned
Nonsense. The PS5 chip clearly has twice as many speedholes along the edge.
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geordiemp
Member
I didn't imply the inner workings are the same, just the manufacturing and packaging process.
But you're wrong on being cooled from both sides.
It's liquid cooling from the top of the die. Nothing more.
Maybe it's a sandwich on the top of the die. The patent would hint to that.
Need a real teardown without cuts for that
No its both sides cooling on the back that spring plate is transferring head to the back plate which has copper on it.
geordiemp
Member
I didn't imply the inner workings are the same, just the manufacturing and packaging process.
But you're wrong on being cooled from both sides.
It's liquid cooling from the top of the die. Nothing more.
Maybe it's a sandwich on the top of the die. The patent would hint to that.
Need a real teardown without cuts for that
It was a bit blue peter with cuts to one I prepared earlier for showing easier. Upclose and beow the cover plate.
Its taking some heat from the back for sure as well as TIM alloy from where we would expect. The Sony patent suggested this option in small print.
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LeftThumbstick
Member
Probably because they are different lol.
phil_t98
#SonyToo
hard to tell really as there is no scale to the picture
Dural
Member
No its both sides cooling on the back that spring plate is transferring head to the back plate which has copper on it.
That's not cooling the APU from the underside, that looks to be cooling the power regulation. You can clearly see what the heatpipe is touching and it's not the APU.
-Arcadia-
Banned
Maybe the thread title is correct parlance and I’m ignorant, but I can’t help but laugh at the thought of both of them being made out of fabric.
Like denim or something, and having to be ironed and put on the board without any creases. Maybe Cerny has a last minute addition and adds a literal patch.
Like denim or something, and having to be ironed and put on the board without any creases. Maybe Cerny has a last minute addition and adds a literal patch.
geordiemp
Member
Could be, it was a quick video and they had parts prepared for showing and edited so it was not easy to follow. Coudl just be grounding.
Dr. Kitty Muffins
Member
They want to avoid the China tariffs at all costs.