I thought a little Mark Cerny was getting shipped inside each one to blow on it when it got hot
I just want the teardown tbh - I'm not going to feel confident with a heatsink and a sheet of liquid metal. Probably the two pertinent parts are what problems does it solve, and whether these are generalised semiconductor issues or specific to the semiconductor used by Sony. It sounds interesting though from a purely tech point of view. Sounds like it changes state so there will be questions raised around brittleness as well. As with anything like this, the innovation looks cool it's all in the delivery when it's first generation at scale. Definitely taking a chance, but I'm surprised they wouldn't have pre-tested with the last iteration of the PS4 PRo SKU's for example. Just to make sure the process works at this level and get some early indicators.
[0004]
However, when the amount of heat generated by the semiconductor chip increases, it becomes difficult to sufficiently cool the semiconductor chip due to the thermal resistance of the grease. In the semiconductor device of Patent Document 2, instead of grease, a metal that is liquefied by heat during operation of the semiconductor chip is used as a heat conductive material between the semiconductor chip and the radiator. When such a metal is used, the thermal resistance between the semiconductor chip and the radiator is lowered, and the cooling performance of the semiconductor chip can be improved.
[0005]
In a structure in which a fluid metal is used as a heat conductive material, it is possible to limit the range in which the heat conductive material spreads even when the semiconductor device changes its posture or vibrates in order to sufficiently exert its cooling performance. is important. Further, it is important that the force sufficiently acts on the semiconductor chip when the radiator is pressed against the semiconductor chip. That is, the adhesion between the semiconductor chip and the radiator is also important.