Can a mod put the time and date of the conference in the title? Thursday, 10 AM New York time IIRC.
A countdown clock could really help for those like me who just cant do the math to get to the correct time zone.
Well to help you see where I'm coming from I'm expecting the GPU to have 640 ALUs. I also expect Nintendo to continue to use clock multiples. Since we know the DSP (at least originally) is 120Mhz, then I expect the GPU to be 480Mhz which would put it at 614.4GFLOPs. So using that if I applied that to all the components I could see it like this.
DSP - 120Mhz
GPU - 480Mhz
DDR3 - 240Mhz (or 960Mhz depending on how you prefer to look at it)
CPU - 1440Mhz, 1920Mhz, or 2400Mhz
eDRAM - ? (couldn't find clock speed info)
So IF Nintendo "fine tuned it", in this scenario it would be at 600Mhz IMO and would take it to 768GFLOPs. I'd like it, but I wouldn't expect it. They're free to prove me wrong though.
No seriously guys.
Do we get to see anything?
No seriously guys.
Do we get to see anything?
Here you are sir. Birmingham is where I am, time will be the same, don't worry.
*confused*
Nothing. And that's the problem
Here you are sir. Birmingham is where I am, time will be the same, don't worry.
Everything.
Is this Birmingham UK or Birmingham US?
This, what do you meant anyway.
Here you are sir. Birmingham is where I am, time will be the same, don't worry.
Oh that old thing!
Why did that stop you from replying, though?
Curse all of you who are predicting a PAL 2013 release. At least our Wii Us will be able to play Another Code R
Curse all of you who are predicting a PAL 2013 release. At least our Wii Us will be able to play Another Code R
UK. Same time left though.
I've probably missed a post or two, but didn't Nintendo confirm a global launch already? At least, in all major territories I'm 90% sure they did.
Faced with intense scrutiny, investor pressure and the first fiscal year losses for his company in over 25 years, Nintendo president Satoru Iwata once again reiterated plans for the future. Notably that includes making sure Wii U is available globally by the 2012 holiday season.
I've probably missed a post or two, but didn't Nintendo confirm a global launch already? At least, in all major territories I'm 90% sure they did.
Arrg, stimey the blokey, er yer rotten scallywags. Drowse the fratch, arrghh. Stick it up yor er argh, eh rats.
Arrgh. the stench of the sea.
........
Footprint – More functionality fits into a small space. This extends Moore’s Law and enables a new generation of tiny but powerful devices.
Cost – Partitioning a large chip into multiple smaller dies with 3D stacking can improve the yield and reduce the fabrication cost if individual dies are tested separately.[9][10]
Heterogeneous integration – Circuit layers can be built with different processes, or even on different types of wafers. This means that components can be optimized to a much greater degree than if they were built together on a single wafer. Moreover, components with incompatible manufacturing could be combined in a single 3D IC.[11]
Shorter interconnect – The average wire length is reduced. Common figures reported by researchers are on the order of 10-15%, but this reduction mostly applies to longer interconnect, which may affect circuit delay by a greater amount. Given that 3D wires have much higher capacitance than conventional in-die wires, circuit delay may or may not improve.
Power – Keeping a signal on-chip can reduce its power consumption by 10-100 times.[12] Shorter wires also reduce power consumption by producing less parasitic capacitance.[13] Reducing the power budget leads to less heat generation, extended battery life, and lower cost of operation.
Design – The vertical dimension adds a higher order of connectivity and offers new design possibilities.
Circuit security – The stacked structure complicates attempts to reverse engineer the circuitry. Sensitive circuits may also be divided among the layers in such a way as to obscure the function of each layer.[14]
Bandwidth – 3D integration allows large numbers of vertical vias between the layers. This allows construction of wide bandwidth buses between functional blocks in different layers. A typical example would be a processor+memory 3D stack, with the cache memory stacked on top of the processor. This arrangement allows a bus much wider than the typical 128 or 256 bits between the cache and processor.[15] Wide buses in turn alleviate the memory wall problem.[16]
UK. Same time left though.
I thought it started 3pm our time as it starts 10 am new york 5 hour behind ?.
So, I'm quite excited for NSMBU now and I hope that Pikmin turns out to be just awesome.
I thought it started 3pm our time as it starts 10 am new york 5 hour behind ?.
I think well see a November 18 US release to capitalize on the Thanksgiving shopping week. Japan will launch that same week, but not on a Sunday. The international launches will be later with UK hitting in 2012 and other PAL territories slipping into 2013." - Peer Schneider; Publisher, IGN.com
"If there's one thing that Nintendo can count on, it's Christmas in North America. We'll have the Wii U (and a carefully-planned shortage of units for good PR) in mid November. I think Japan will get the system a few days after North America, and Europe may just have to wait until 2013. Unlikely: Wii U is ready to ship, and we'll be bringing a few consoles back to the office next week." - Sam Claiborn; Executive Editor, IGN.com
We'll have the Wii U (and a carefully-planned shortage of units for good PR)
Plenty of Birmingham, UK members in here
I would kill for a Decmeber UK launch.
What bullshit. Fucking IGN.
People
You don't understand
I will destroy this planet if I have to wait until 2013 to get one
Nibel
Destroyer of Worlds
(Today, 09:39 AM)
;P
Can anyone explain to me why they believe the Wii U's small form factor prevents the system from say featuring a 1 teraflop GPU?
Let me answer your question with another question:
Can you buy a decent gaming laptop for under $300?
Can you buy a decent gaming laptop for under $300?
Can anyone explain to me why they believe the Wii U's small form factor prevents the system from say featuring a 1 teraflop GPU?
Having had a look at the Wii U's dimensions myself, it appears to have more than enough space to house and cool such a hot GPU. The system uses an external power supply, features limited external ports, and the disk drive appears to be a slimline variant. So for the most part, there's little else inside the case taking up space from the core components.
Given there's plenty of laptops on the market running CPUs and GPUs with significantly higher TDP in thiner chasis. I can't understand why this system couldn't feature more powerful hardware. Laptop PCBs tend to be quite small, as a majority of a laptop's space is taken up by HDD, ROM drive, battery, track pad, and keyboard. When you gut a laptop, even a high end one like say the HP Envy 15, the actual motherboard with the core components takes up next to no real space.
If Nintendo were to use vapor chamber cooling and heat pipes in conjunction with fans, it'd say there is more the enough space in there to cool a combined total of 150w TDP. Vaper chamer is cheap, as too are aluminium heat pipes, and both provide significant thermal disipation.
I know the Wii U wont have this kind of power, but i think it's wrong for people to be saying the Wii U's chasis simply couldn't cool a 100+ TDP system. It could, but a bit of extra coin would need to be spent on cooling sollutions and perhaps increased noise from fans.
My source told my is not accurate. Sorry for the inconvenience.