Md Ray
Member
Gamers Nexus means business. For the PlayStation 5's thermals and power tests, they go much more in-depth than any publication you could imagine. Video below.
Their findings here:
Summary:
Noise levels
EDIT: Very well explained:
Their findings here:
Summary:
Noise levels
- Fan noise level: 33-35~dB under full load.
- Sony has listened to the complaints about previous-gen consoles and has done a pretty good job at handling the fan noise comparatively.
- Removing one side panel is not very beneficial, but removing both the panels improved temps by -5 °C across VRM, memory, SoC, etc. Not a reasonable solution but Sony could improve this by putting some slats into the side panels, specifically near the fan.
- They didn't hear any coil whine, different games could trigger it.
- Impressive power consumption and efficiency relative to the output in terms of the graphics capabilities, frame-rate, and overall perf is significanly higher than past devices, kudos to AMD for the SoC design.
- Can't get the actual on-die temp measurement of the APU (SoC), it's in the 70 °C range from their tests on the backside of the SoC between the MLCCs. Typically a pretty good indication of the actual die temp.
- One of the memory modules is thermally a bit warmer than GN would like at 93 to 95 °C, but it's a casing measurement so it is possible the silicon itself is somewhat cooler. Can't say for sure unless given access to the on-die sensor for the actual temp of the memory silicon itself.
- Sony is definitely heavily lacking in cooling design for its memory specifically and thinks there should be better heatsink contact to the memory chips.
- Sony can improve memory thermals significantly and the easiest way is through full coverage of the thermal pads on memory modules by increasing the pad's contact patch.
EDIT: Very well explained:
The memory isn't cooled enough as it should be because there is less optimal contact between the memory modules and the steel plate inside which is also less thermally conductive than aluminum. The design could be altered to cool the memory more. The PS5 faceplates also increase temperatures slightly, so maybe adding some vents into the design there could help with thermals too.
The memory is too hot for GN to be comfortable with, but maybe Sony has data that suggests that it's good enough. CPU temps seem fine.
Obviously, Sony made certain design decisions regarding aesthetics, price, manufacturing ease, and many other variables so they did the best they could do given their time and resources, but no one is perfect, and thus any potential flaws in their design can and should be pointed out.
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