not really indeed, we know nothing on PS4, I mean nothing.
Other then devs(those that he contacted) are less confident in PS4 (because they know nothing)- from aegis.
With all due respect to Jeff, his posts are not source, rumor or leak. just speculation.
Yes most is speculation based on Sony CTO or VP Technology platform and then research on the technology mentioned by them but occasionally something definite that confirms rumors like below:
http://www.neogaf.com/forum/showpost.php?p=45173413&postcount=3108
HWiNFO64 is a professional hardware information and diagnostic tool supporting the latest components, industry technologies and standards. HWiNFO64 is designed to collect and present the maximum amount of information possible about computer's hardware
These appear to be new hardware by AMD that the software can report on. Posted Oct 8, 2012 which likely means it exists in some form BEFORE Oct 8, 2012.
Added AMD Sun, Neptune, Ibiza, Cozumel, Kauai, Hainan, Curacao, Aruba, Richland Devastator/Scrapper, Thebe, Kryptos, Samara, Pennar.
Which confirms multiple Sweetvar26 rumors. It also seems to indicate both Kryptos and Thebe silicon are finalized so any delays are yield (less likely) or internal to Sony and Microsoft reasoning's.
Also if there is a discrete GPU as in APU + GPU it most likely will be one of the following: Sun, Neptune, Ibiza, Cozumel, Kauai, Hainan, Curacao, Aruba and the AMD APU base SoC that is modified to produce Thebe and Kryptos is likely Samara/Pennar. Samara/Pennar are 2014 designs at 20nm or with only the GNB at 20nm also as 2014 designs they could have two 128 bit DDR3 interfaces or as the two OCt 2011 Amkor PDFs one for internal AMD and one for a trade show shows wide IO for Nov 2013 and wide IO for mid 2014.
http://hothardware.com/Reviews/AMD-Demos-Temash-Kabini-and-Richland-APUs-Partners-with-Asus-HP-and-Vizio-For-Tablets-Ultrathins-and-AllinOnes/ said:
The Temash chip in question is the A6-1450, a quad-core SoC clocked at 1GHz with Radeon HD 8280 graphics, 2GB of DDR3-1066 memory, and running (oddly) Windows 7.
I think we can take this as a min spec for the APU; 8000 series bottom end and not a "M" series as it needs to have the GNB (northbridge, southbridge, video decoders, audio and video out).
Edit: Just my opinion but BY3D posters have been speculating about eSRAM and eDRAM in the next generation game consoles if as rumored DDR3 is being used instead of GDDR5 because of cost/size or wide IO because it's not ready yet. Custom memory for the game consoles has already been confirmed in a Micron stock holders meeting and that can be custom size GDDR5 in the short term so eSRAM and EDRAM which are more expensive options and would increase the complexity and lower yield are not needed. If wide IO is used then again there is no need for eSRAM or eDRAM and that (from the AMKOR PDF) is the long term plan which depends on 3D stacked DDR3 and DDR4. A console is a long term design. The following is a prototype AMD GPU with stacked DDR3 on interposer not GDDR5, the bottom two packages could be CPU packages making this a prototype SoC including wide IO memory with both CPU package and GPU connected to a common UMA memory.
We know very little about PS4, but industry rumors tell us that both X720 and PS4 will have similar performance. The only concrete proof is interview with Sony's technology chief [early 2012] which mentioned focus on APU and stackable chips.
Sony CTO
http://mandetech.com/2012/01/10/sony-masaaki-tsuruta-interview/
SemiAccurate take
http://semiaccurate.com/2012/03/02/...l-be-an-x86-cpu-with-an-amd-gpu/#.UO7dxOTWIw4
Sony VP Technology platform
http://www.semicontaiwan.org/en/sites/semicontaiwan.org/files/SiP 3D IC_Teiji_Yutaka_SONY.pdf
And this in a Yole PDF on Sony plans
http://www.i-micronews.com/upload/Rapports/3D_Silicon_&Glass_Interposers_sample_2012.pdf
On AMD site => AMKOR which packages for AMD/GF will be packaging Interposer/logic (GPU + CPU)/memory Nov 2013
http://sites.amd.com/la/Documents/TFE2011_001AMC.pdf
On AMKOR site for the industry in general, same technology but middle of 2014 for everyone else =>
http://www.amkor.com/download.cfm?d...DC8BFAE253&typename=dmFile&fieldname=filename
You will notice a similarity between the last half of the Sony VP Technology platform slides above and the Microsoft leaked 720 powerpoint. Also in the powerpoint is Microsoft speculation on how, not if, Sony was going to support XTV.
http://forum.beyond3d.com/showthread.php?t=62038
You can read the above and draw your own conclusions or read a journalist's speculation who has read the above.