GC was a tank. Same can't be said of the Wii or Wii U.
Even if they're still of higher quality than X360 tupperware finish; they're essentially good for what they are, or appropriate when it comes to finishing, and then there's a little more stress test than usually applied by other parties; that's it.Probably something you can ignore altogether, as Nintendo is, using parts from various sellers.
Failure rate for RAM that is not that fast and on a mature process is very low; it's down to how many write cycles it's supposed to endure. (and they're a lot)Probably a non factor, really.
Nintendo went with a smaller battery in order to save in costs.I'd say given how light on chips that thing is, being resistant to heating was not a concern of the highest order.Not really due to that.
It was the solder, european union had banned lead from them, so the boiling point was lower than before. So X360's solder would boil down over time and pins would become disconected due to it; which is why you can resolder them and never have problems again.
Same thing happened to Nvidia cards on laptops
on Macs, of all things. (expensive, supposedly well built)
Nintendo would never approach such heat production and overall parts price Microsoft was paying back then for the same package, so yeah, even though I agree the construction quality for X360 was bullcrap, it's really like comparing apples to oranges (and not really the culprit for the RRoD). Nintendo likes low wear solution (slow spinning fans, cooling not hugely overdependent on them, stuff like that) said design could never save the X360 from desoldering/heating.