Go on
From the other thread
Yeah, but should that always be the goal?
And from the link above.....
Compared to this traditional 2D architecture, 3D ICs provide several significant advantages:
1. Footprint
Obviously, stacking multiple dies atop one another produces a chip that takes up less space than if those dies were side by side. If the layers are aggressively thinned, a multi-layer 3D-IC is actually no thicker than a traditional 2D chip. The tiny size of 3D-ICs is extremely valuable in miniaturized devices such as cell phones and IoT applications.
2. Speed
Dies stacked in a 3D chip are much closer together than chips on a circuit board. The shorter distances allow electronic signals to travel more quickly from one component to another. 3D stacked devices have shown as much as 5x speed improvement over comparable 2D solutions.
3. Power
Shorter connections automatically require less power, but 3D ICs have another power-saving trick. When an electronic signal travels from one chip to another, it passes through special circuitry that screens out any accidental electrostatic discharge (ESD). These ESD filters consume energy. Signals that travel from one layer to another within a 3D-IC do not require ESD checks. Tests have seen as much as 90% reduction in power consumption.
4. Heterogeneous Integration
Because the layers in a 3D IC are manufactured separately, they can be built differently. This is more important than it might seem! The process in which a die is built affects the behavior of the components on that die: one process makes better capacitors, another makes faster transistors, etc. Even more interesting, the layers may be built at different process nodes – that is, the electronic components may differ in size. This affects the cost, complexity, and performance of each layer. It is even possible to stack layers that are built of different materials. All of these possibilities mean that a 3D IC can combine the best of each process, node, and substrate without compromising some components to accommodate others. In fact, a multi-die stack can contain combinations that are flatly impossible to achieve on a 2D chip.