This guy is so clueless... lol
He references the Bloomberg article taking about a supposed camera in the PS5, which is nonsense as the actual article is talking about DRAM usage in Sony's Alpha Compact System Cameras, where they decided to cancel an updated version to the pricing and availability of DRAM.
In addition, his arguments against a chiplet-based design is equally clueless. A 40 CU Navi 10 based monolithic APU would be a little smaller than 350 sqmm, which while it would probably yield well on 7nm, the yields for PS4 Pro are entirely irrelevant because it's made on an entirely different process node.
Equally, splitting said chip into discrete GPU and CPU dies would provide a huge saving in raw silicon cost, principally because of the CPU die being tiny, means they will yield well over 150% more CPU dies per wafer, and if they don't cut down the cache sizes on the CPU (which is unnecessary for discrete dies) they can sell what spare CPU dies they don't back to AMD to be flogged in the discrete desktop CPU market (or rather AMD will credit them with a deeper discount as they actually buy the chips directly from AMD).
Also, packaging costs won't come anywhere close to the nullifying the saving on increased yields with discrete chips. Especially if they go with an MCM design with or without an interposer (the latter could be facilitated by something like an integrated fan-out packaging technology).
In addition, a fully integrated design, could really benefit from an MCM design, with the ability to shunt some of the none essential gubbinz off onto the interposer die fabbed on a cheap 10, 14 or even 16nm FF node.