notice the part where the APU runs hotter... you know, the main source of heat inside this console...
Not necessarily the APU is hotter.
Both PS5's produce the same heat because they have the same power draw, which heat is tied to.
So how can one be hotter than the other in the same environment?
I believe both SOC's have the same temperature if an internal die sensor is used, but because of where the thermocouple was place different reading were recorded due to the heatsink.
This isn't about Austin, but me trying to understand the PS5 cooling system.
It took me awhile to wonder how can the SOC be hotter and not the RAM modules.
That extra heat would surely travel through the PCB and make the RAM modules hotter. The RAM cooling is not that much better except for better contact with the base plate.
Points Steve said about the new model PS5 cooling in DF video:
-better contact with the base plate on some memory modules.
-heatsink probably has less flow resistance.
-better guided airflow so it gets efficiently out of the box.
-and could come down to fin pitch, density and orientation.
Steve also said it's difficult to measure the SOC temperature because of the Liquid Metal and it would be better to have access to the internal die sensor, which probably only Sony has access to.
My conclusion is the new heatsink maybe efficiently drawing a higher amount of heat away from the SOC, thus making the RAM modules cooler by not allowing to much heat to travel through the PCB.
The thermocouple behind the SOC could just be recording heat gathering in that area due to less flow resistance of the heatsink thermal efficiently.
This is just my conclusion or more like a theory based on all the information I've seen and not to be taken as fact. It just doesn't click with me that it has cooler RAM modules and VRM MOSFET, but a hotter SOC, unless some kind of better overall cooling is going on.
Hopefully Gamers Nexus do the other videos on the PS5 cooling.