from looking at AMD road maps for 2013 I'm thinking the PS4 will have
Kaveri - APU with a embedded GPU with about the same performance level as a HD 7750
Heterogeneous Systems Architecture with Unified Memory for CPU/GPU
the Unified Memory might be the reason it was reports of the PS4 going with only 2GB since they would be going for the higher priced Ram that would be fast enough for the GPU & APU.
using the faster ram that's usually for the GPU as the main memory would make sense since the APU also has a GPU in it & when the APU & GPU work together in the older setup that's out now the GPU has to work at the speed of the APU memory so why not have fast memory all around so the GPU doesn't lose memory bandwidth when working with the APU.
but then again if they are going with a SOC things might not be so advance.
Good posts, I'll continue with HSA:
AMD Fusion System Architecture is now Heterogeneous Systems Architecture
FSA was the blueprint for AMDs overarching design for utilizing CPU and GPU processor cores as a unified processing engine, which we are making into an open platform standard. This architecture enables many benefits, including high application performance and low power consumption.
Our software partners are already taking advantage of the power and performance advantage of APU and GPU acceleration, with more than 200 accelerated applications shipped to date. The combination of industry standards like OpenCL and C++ AMP, alongside FSA, is ushering in the era of heterogeneous computing.
Together with these software partners, we have built a heterogeneous compute ecosystem that is built on industry standards. As such, we believe its only fitting that the name of this evolving architecture and platform be representative of the entire, technical community that is leading the way in this very important area of technology and programing development.
FSA will now be known as Heterogeneous Systems Architecture or HSA. The HSA platform will continue to be rooted in industry standards and will include some of the best innovations that the technology community has to offer.
1) IBM, Global Foundries (AMD Spinoff) and Samsung Forges have a joint technology group
2) IBM 3D stacking with standards going on-line in 2013 (Standards between the above and more)
3) 3D stacked memory by Micron with Samsung support in the IBM forge 2013. Memory controller is part of the logic stack and only 2 and 4 gig stacks available in 2013. These do not work for most of the speculated targets but do work for game consoles.
Several posters do not believe 3D stacking or
3D stacked memory will be available in time for next generation game consoles. My opinion is that 2013-2014 was chosen as a target date because 3D stacking and 3D stacked memory is scheduled to be available. IT's two years (2011) after early speculation had a next generation playstation release.
I haven't read anywhere about any plans other than Sample quantities in early 2013 with production level quantities late 2013. The memory controller included as part of the logic layer eliminates it as a candidate for current high end designs.....I.E. it was not designed for the markets speculated in articles, also and the big point here is the 2013 run is 2 gig and 4 gig 3D stacked memory ONLY. Tell me what high end application is going to use such a small amount of memory. The memory controller included in the 4 gig 3D stack precludes using multiple memory chips so if anything it looks like it's designed for the SMALL end not upper end.
I think 3D stacked memory in 2013 taking the place of DDR5 or even XDR2 is a huge design plus for a game console. The 2013 Fusion APU design has a common memory pool but not a memory controller. Most PC CPU chipsets include the memory controller, that it doesn't and 3D stacked memory with memory controller is going to be available in 2013 has me thinking the Micron 3D stacked memory will be used by that chipset. 4 gig could be for Xbox and 2 Gig for Sony, this could change but the 2gig version is probably going to be much cheaper as somewhat defective 4 gig versions can be used as 2 gig.
Even if the first run of 3D stacked memory is more expensive, over time it should be far less expensive than DDR5 or XDR2 as it uses DDR3 but is slightly faster than XDR2 and reduces Motherboard complexity, eliminates motherboard wires between multiple memory chips which can eliminate a need for a differential buss (2 wires for each data line) needed by XDR2.
onQ123 said:
"The Cell Broadband Engine that powered the PS3 cost $400m to develop; the main SoC for the incoming console is likely to be a 3D stack incorporating thru-silicon-via technology and could be the first $1bn hardware design project."
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He describes the architecture in broad terms: "You are talking about powerful CPU and GPU with extra DSP and programmable logic."
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these quotes alone lets us know it's not going to be a simple "AMD's A8-3850 APU and Radeon HD 7670 GPU"
& looking at the AMD road maps & reading about Heterogeneous Systems Architecture & other things in the road map has me thinking that Sony is building this whole SOC around the HSA including the HSA GPU that's in the road map for 2014.
Sony can't afford the R&D in the quote, it's probably a total of all the partners in the design with each able to use the advances provided by the R&D. 2014 APU & GPU make sense if there are close ties between partners in new HSA designs.
It's possible that the next Xbox is using the same chipset....the AMD "HSA Fusion CPU-GPU (2014 design) with unified memory pool and 3D stacked memory is perfect for a game console".
Anyone know of anything similar using IBM Power; there can't be because IBM is not as advanced as Nvidia and AMD in GPU designs.
It's not just an industry change in hardware, Software is changing too:
http://forwardthinking.pcmag.com/none/290834-a-big-week-for-supercomputing
http://forwardthinking.pcmag.com/ch...erogeneous-processors-the-future-of-computing
So if Fusion designs (CPU-GPU) in the same package with HSA efficiencies are part of next generation consoles then the only economical off the shelf choice is AMD. Nvidia is going with ARM-GPU fusion and IBM does not have GPU designs to integrate. Sony can always design a custom fusion chip with huge R&D which I think unlikely, same for Microsoft. Early rumors appear to be supportable given this information we (royal we) did not have. Intel and AMD have a similar roadmap with similar fusion designs but from articles, Intel is not a candidate because they won't release IP for game consoles.