Usage of digital audio means that headsets should gain their own amplifiers, DACs and various other logic, which is currently located inside smartphones. Intel proposes to install special multi-function processing units (MPUs), which will perform beam forming, noise suppression, acoustic echo suppression (AES), acoustic echo cancellation (AEC), non-linear processing and other operations. The MPUs will also support HDCP technology, hence, it will not be possible to make digital copies of records using USB-C digital headset outputs. It is unlikely that audio processing will be offloaded to external headsets completely, but the latter will clearly gain their own chips. This may, however, see a spike in cost, especially at the super-low end.
A good thing about USB Type-C headsets with MPUs is that they are going to be software upgradeable and could gain functionality over their lifespan. Intel admits that such MPUs will make digital headsets more expensive compared to analog devices, but high volumes and new process technologies will help to reduce the cost of digital headsets over time. In fact, USB Audio headsets and audio chips for them are not something completely new. For example, Plantronics Audio 655 DSP headset costs $49.99, whereas CMedia’s HS-100 chip for headsets is available $1. Therefore, from the cost perspective, digital headphones should not be too much more expensive in general. Meanwhile, Intel wants USB-C digital audio headsets to offer “significant value at higher end” and have improved functionality in a bid to become popular among consumers.